Conductive Paste
Conductive pastes are mixtures of metal powders, such as silver and copper, in resin. They connect electronic components to the circuit board and enable the flow of electric current. Our partner Kyoto Elex, a joint venture between DKS and DOWA managed by DKS, manufactures conductive pastes in a wide range of grades and specifications that can be individually tailored to your application and your requirements.
As a distributor with long-standing partnerships with leading Japanese manufacturers, we guarantee you a secure and economical supply of raw materials – from resin cured to sintered conductive paste.
Request ConsultationConductive Pastes from Kyoto Elex
Many electrically powered products rely on conductive pastes from Kyoto Elex: from automobiles (filters, capacitors, inductors, sensors for autonomous driving) through smartphones and thermal printers to medical devices such as CT and MRI scanners, as well as PCs and game consoles, where they help suppress interference. The pastes consist of metal or glass powders combined with resin in a suitable form and concentration, and can be freely adapted to your needs.
Our quality management system is certified to DIN ISO 9001:2015. Looking for a magnetic material instead? Discover our plastic-bonded magnetic compounds or hard magnetic ferrite powder.
» Resin Cured Conductive Paste (Resin Curing Type)
The resin curing conductive pastes are cured at comparatively low temperatures and are suitable for wiring on glass, wafers and film, for conductive adhesive bonds (e.g. die attachment), and for electrodes of electronic components. Resistivity values that previously required 200 °C are now achieved at just 100 °C – opening up new possibilities, for example for wiring on film substrates.
Application methods: Sc = Screen printing, Di = Dispense, St = Stamping, Dp = Dipping
Wiring applications
| Products | Applications | Features | Type | Curing Conditions | Resistivity (Ω-cm) |
Application Methods |
|---|---|---|---|---|---|---|
| DD-1630L-245 | Wiring on glass, Wiring on wafer | Low resistivity | Ag | 200°C-40 min. | 7×10-6 | Sc, Di |
| DD-3800B-103 | Wiring on glass, Wiring on wafer | Low resistivity | Ag/Cu | 200°C-40 min. | 7×10-6 | Sc, Di |
| DD-1630L-885 | Wiring on film | Low resistivity, Low temperature curing | Ag | 120°C-60 min. | 5×10-6 | Sc, Di |
| DD-1630M-653 | Wiring on film | Flexibility, Low temperature curing | Ag | 100°C-60 min. | 1×10-4 | Sc, Di |
Adhesive applications
| Products | Applications | Features | Type | Curing Conditions | Resistivity (Ω-cm) |
Application Methods |
|---|---|---|---|---|---|---|
| DD-1930L-133 | Die attachment, LEDs, etc. | Solvent-free | Ag | 180°C-30 min. | 7×10-5 | Sc, Di, St |
| DD-1930L-173 | Die attachment, LEDs, etc. | Solvent-free, High heat resistance | Ag | 180°C-30 min. | 3×10-4 | Sc, Di, St |
| DD-1930L-360 | Die attachment, Power ICs, etc. | High thermal conductivity | Ag | 200°C-40 min. | 8×10-6 | Sc, Di, St |
| DD-1960A-537 | Die attachment, Solder alternative | Fast low temperature curing | Ag | 150°C-5 min. | 3×10-3 | Sc, Di, St |
Electrode Applications for Electronic Component
| Products | Applications | Features | Type | Curing Conditions | Resistivity (Ω-cm) |
Application Methods |
|---|---|---|---|---|---|---|
| DD-1820K-425 | Tantalum electrolytic capacitors, Element coating | Low resistivity | Ag | 150°C-30 min. | 2×10-5 | Dp |
| DD-1790 | Aluminum electrolytic capacitors, Element coating | Low resistivity | Ag | 200°C-40 min. | 1×10-5 | Sc, Di |
| DD-3820G-510 | Tantalum/aluminum electrolytic capacitors, Lead frame attachment | Low silver content, Ag/Cu type | Ag/Cu | 200°C-40 min. | 5×10-5 | Sc, Di |
| DD-1820X-580 | Tantalum/aluminum electrolytic capacitors, Lead frame attachment | Low silver content, Ag type | Ag | 200°C-40 min. | 3×10-4 | Sc, Di |
| DD-1950A | MLCC/MLCI, Soft termination | Flexibility, Shock resistance | Ag | 200°C-60 min. | 1×10-4 | Sc, Dp |
| DD-1950B | Resistors, Base electrodes for plating | Plateability | Ag | 200°C-60 min. | 1×10-4 | Sc, Dp |
» Sintered Conductive Paste (Sintering Type)
The sintered conductive pastes are fired at high temperatures, achieving particularly low resistivity values and high adhesion strength. They are used for electrodes of electronic components, for co-sintering of green sheets, and for post-sintering of hybrid ICs. By developing particles in a wide variety of shapes – including silver and silver-coated particles – the silver content is reduced; at the same time, Kyoto Elex is continuously improving the dispersion of ultra-fine electrode particles (nanoparticles) for thin-film electronic components.
Application methods: Sc = Screen printing, Me = Metal mask printing, Dp = Dipping
Electrode Applications for Electronic Component
| Products | Applications | Type | Sintering Conditions | Resistivity (mΩ/□/10µm) |
Adhesion Strength (N/2mm□) |
Application Methods | |
|---|---|---|---|---|---|---|---|
| DD-6810A-100 | Thermistors | Al | 750°C-7 min. | Air | ≦20 | ― | Sc |
| DD-1240 series | Piezoelectric elements, External electrodes | Ag | 600~850°C | Air | ≦3 | ≧40 | Sc, Dp |
| DD-1235 series | Inductors, External electrodes | Ag | 600~850°C | Air | ≦3 | ≧40 | Sc, Dp |
| DD-1411F series | Inductors, Internal electrodes | Ag, AgPd | 600~850°C | Air | ≦3 | ― | Sc |
| DD-1375 series | Varistors, External electrodes | Ag/X | 600~850°C | Air | ≦3 | ≧40 | Sc, Dp |
| DD-1204A-102 | Thermal heads, Electrodes | Ag | 810°C-7 min. | Air | ≦3 | ≧40 | Sc |
| DD-1411D | Glass, Electrodes | Ag | 500°C-10 min. | Air | ≦3 | ≧30 | Sc |
| DD-6820A-200 | Glass/quartz, Electrodes | Al | 600°C-10 min. | Air | ≦30 | ― | Sc |
Green Sheet (co-sintering) Applications
| Products | Applications | Type | Sintering Conditions | Resistivity (mΩ/□/10µm) |
Adhesion Strength (N/2mm□) |
Application Methods | |
|---|---|---|---|---|---|---|---|
| DD-1411 series | Shrinkage type, Wiring | Ag,AgPd | 900°C | Air | ≦3 | ― | Sc |
| DD-1421 series | Shrinkage type, Vias | Ag,AgPd | 900°C | Air | ≦3 | ― | Sc, Me |
| DD-1400D-591 | Non-shrinkage type, Wiring | Ag,AgPd | 900°C | Air | ≦3 | ― | Sc |
| DD-1421B-302 | Non-shrinkage type, Vias | Ag,AgPd | 900°C | Air | ≦3 | ― | Sc, Me |
Hybrid IC (post-sintering) Applications
| Products | Applications | Type | Sintering Conditions | Resistivity (mΩ/□/10µm) |
Adhesion Strength (N/2mm□) |
Application Methods | |
|---|---|---|---|---|---|---|---|
| DD-1240 series | Aluminum substrates | Ag | 850°C-7 min. | Air | ≦3 | ≧50(≧30) | Sc |
| DD-2300 series | Aluminum substrates | Ag/Pd | 850°C-7 min. | Air | 3 ~ 70 | ≧30(≧20) | Sc |
| DD-1130 series | Aluminum substrates | Ag/Pt | 850°C-7 min. | Air | ≦4 | ≧40(≧30) | Sc |
| DD-3780D series | Aluminum substrates | Cu | 900°C-10 min. | N2 | ≦3.5 | ≧40(≧30) | Sc |
| DD-3670D series | Aluminum substrates | Cu | 600°C-10 min. | N2 | ≦4 | ≧35(≧30) | Sc |
| DD-3780D series | Silicon nitride substrates | Cu | 850°C-7 min. | N2 | ≦5 | ≧30(≧20) | Sc |
| DD-2860 series | Aluminum nitride substrates | Ag/Pd | 850°C-7 min. | Air | 3 ~ 30 | ≧30(≧20) | Sc |
| DD-3850D series | Aluminum nitride substrates | Cu | 900°C-10 min. | N2 | ≦5 | ≧30(≧20) | Sc |
Frequently Asked Questions
What is the difference between resin cured and sintered conductive paste?
Resin cured conductive paste (Resin Curing Type) is cured at comparatively low temperatures and is suitable for wiring, adhesive bonding and electrodes. Sintered conductive paste (Sintering Type) is fired at high temperatures, achieving particularly low resistivity values and high adhesion strength for electrodes, green sheets and hybrid ICs.
How is conductive paste applied?
Depending on the product, by screen printing (Sc), dispensing (Di), stamping (St), dipping (Dp) or metal mask printing (Me) – the exact application methods are listed in the specification tables for each product.
In which industries are conductive pastes used?
Conductive pastes from Kyoto Elex are used in, among others, automotive electronics, smartphones, thermal printers, medical devices, as well as PCs and game consoles.
Can conductive pastes be customized?
Yes. Kyoto Elex manufactures conductive pastes in a wide range of grades and specifications that can be individually tailored to the respective application and requirements.
Do you have Questions?
For further details or to request these documents, please contact us.
You can also find more information on our partner's website:
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